William E. Murphy
3Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Jan 10, 2005 → Apr 24, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7719108B2 | Enhanced reliability semiconductor package | Emerging Cross-Sectional Technologies | 2 | Active |
| US7670877B2 | Reliability enhancement process | Emerging Cross-Sectional Technologies | 1 | Active |
| US7804179B2 | Plastic ball grid array ruggedization | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.