Wonll Kwon
3Patents
1h-index
3Co-inventors
30Inventor score
Filing activity: Feb 21, 2011 → Nov 20, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8710670B2 | Integrated circuit packaging system with coupling features and method of manufacture thereof | Electricity | 4 | Active |
| US8642469B2 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | Electricity | 1 | Active |
| US9252093B2 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.