WonSun Shin
6Patents
6h-index
5Co-inventors
45Inventor score
Filing activity: May 19, 2000 → Mar 17, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6395578B1 | Semiconductor package and method for fabricating the same | Electricity | 311 | Expired |
| US6762078B2 | Semiconductor package having semiconductor chip within central aperture of substrate | Electricity | 126 | Expired |
| US6501184B1 | Semiconductor package and method for manufacturing the same | Electricity | 38 | Expired |
| US7061120B2 | Stackable semiconductor package having semiconductor chip within central through hole of substrate | Electricity | 17 | Expired |
| US6830955B2 | Semiconductor package and method for manufacturing the same | Electricity | 13 | Expired |
| US6512288B1 | Circuit board semiconductor package | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.