Wood Wu
3Patents
2h-index
4Co-inventors
27Inventor score
Filing activity: Jul 21, 1993 → Jul 7, 1994
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5429988A | Process for producing high density conductive lines | Electricity | 84 | Expired |
| US5378646A | Process for producing closely spaced conductive lines for integrated circuits | Electricity | 27 | Expired |
| US5386380A | Bypass scheme for ROM IC | Physics | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.