Wushing Yin
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Nov 16, 2001 → Nov 16, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6610559B2 | Integrated void-free process for assembling a solder bumped chip | Electricity | 29 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.