Wuwen Yi
3Patents
2h-index
13Co-inventors
37Inventor score
Filing activity: Oct 25, 2001 → Sep 22, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7767043B2 | Copper sputtering targets and methods of forming copper sputtering targets | Performing Operations; Transporting | 13 | Active |
| US6713391B2 | Physical vapor deposition targets | Performing Operations; Transporting | 8 | Expired |
| US8118906B2 | Methodology for recycling Ru and Ru-alloy deposition targets and targets made of recycled Ru and Ru-based alloy powders | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.