Xiaolong Wen
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Aug 5, 2014 → Aug 5, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10514406B2 | High resistivity material-based packaging element for electric field sensor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.