High resistivity material-based packaging element for electric field sensor
US10514406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2014 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Feb 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high resistivity material-based packaging element for an electric field sensor comprises: a substrate; a first packaging frame fixed to the substrate; and a first packaging cover fixed to the packaging frame; wherein at least one electric field sensor chip is located in an inner cavity formed by the substrate, the first packaging frame, and the first packaging cover, and at least one of the substrate, the first packaging frame, and the first packaging cover is of a high resistivity material having an electrical resistivity equal to or greater than 108Ω·cm. The present invention can ensure accurate measurement of the electric field, and provide an approach to solve the problem of environmental adaptability, thereby enhancing the stability and reliability of electric field detection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.