Xin Lee
2Patents
2h-index
2Co-inventors
27Inventor score
Filing activity: Jan 3, 2001 → May 21, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6737300B2 | Chip scale package and manufacturing method | Emerging Cross-Sectional Technologies | 85 | Expired |
| US6455941B1 | Chip scale package | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.