Xin-Wei Lo
2Patents
0h-index
5Co-inventors
21Inventor score
Filing activity: Dec 14, 2017 → Jan 11, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10808331B2 | Electroplating system and pressure device thereof | Chemistry; Metallurgy | 0 | Active |
| US10168582B1 | Chip package having a flexible substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.