Chip package having a flexible substrate
US10168582B1 · kind B1 · utility
0Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2017 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Dec 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip package includes a flexible substrate, a chip, a pressure-proof member and a reinforcement sheet. The chip and the pressure-proof member are located on a first surface of the flexible substrate, and the reinforcement sheet is located on a second surface of the flexible substrate. The pressure-proof member at least includes a pair of pressure-proof ribs which are located outside of the chip oppositely. The pressure-proof ribs located outside the chip can protect the chip from the damage caused by the pressure of other component (e.g. curved panel) except the chip package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.