Ya-Ting Ho
3Patents
2h-index
5Co-inventors
33Inventor score
Filing activity: Mar 22, 2005 → Apr 1, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7505109B2 | Heat dissipation structure of backlight module | Electricity | 7 | Active |
| US7385143B2 | Thermal bonding structure and manufacture process of flexible printed circuit board | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8446546B2 | Backlight module with bent reflector sheet and display panel device | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.