Heat dissipation structure of backlight module
US7505109B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2006 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Aug 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The heat dissipation structure of the backlight module of the present invention comprises a circuit board, a heat-conductive element (such as thermally conductive glue) and a light-emitting diode (LED) chip, wherein the circuit board has an electric circuit layer and a heat conductive layer respectively formed on two opposite surfaces thereof. The circuit board has a plurality of through holes penetrating through the electric circuit layer and the heat-conductive layer of the circuit board, wherein each of the through holes is filled with heat-conductive material. The heat-conductive element is placed on the circuit layer and covers the through holes, and the LED chip is disposed on the heat-conductive element and is electrically connected to the electric circuit layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.