Yan Chen
2Patents
0h-index
4Co-inventors
27Inventor score
Filing activity: Oct 19, 2016 → Jul 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10064315B2 | High heat-dissipation circuit board assembly system and power supply including the same | Electricity | 0 | Active |
| US12253259B2 | Combustion systems including heat modules, and associated devices and methods | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.