High heat-dissipation circuit board assembly system and power supply including the same
US10064315B2 · kind B2 · utility
0Cited by
1References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 19, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Oct 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10606
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.