Yanting Tian
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Nov 1, 2015 → Nov 1, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9362211B1 | Exposed pad integrated circuit package with mold lock | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.