Exposed pad integrated circuit package with mold lock
US9362211B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2015 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Nov 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package has an exposed die pad with a trench and openings in the trench that are filled with encapsulant to form an encapsulant ring near the edges of the die pad. During assembly, the encapsulant passes through the openings and fills the trench to form the encapsulant ring. The ring helps to keep the die pad from separating from the encapsulant caused by thermal cycling. Air vents might be included in the die pad surface to allow air to escape from the trenches and the openings as they fill with encapsulant. Trenches from the openings to the die pad edge on the chip-side of the die pad might be included to increase adhesion of the encapsulant to the die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.