Yao-Bin Wang
6Patents
2h-index
3Co-inventors
36Inventor score
Filing activity: May 31, 2011 → Apr 20, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8569129B2 | Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics | Electricity | 9 | Active |
| US9406607B2 | Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics | Electricity | 3 | Active |
| US9893010B2 | Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics | Electricity | 2 | Active |
| US10269699B2 | Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics | Electricity | 2 | Active |
| US10629528B2 | Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics | Electricity | 0 | Active |
| US11075162B2 | Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.