Yaping Ge
3Patents
1h-index
8Co-inventors
27Inventor score
Filing activity: Feb 17, 2017 → Feb 27, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10748800B2 | Chip bonding apparatus and method | Electricity | 1 | Active |
| US10942458B2 | Exposure system, exposure device and exposure method | Performing Operations; Transporting | 1 | Active |
| US10903105B2 | Flip chip bonding device and bonding method | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.