Chip bonding apparatus and method

US10748800B2 · kind B2 · utility

Assignee

• SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD · CN

Inventors

• Yuebin Zhu · Shanghai, CN
• Feibiao Chen · Shanghai, CN
• Hai Xia · Nanhu, CN
• Bin Yu · Cupertino, US
• Song Guo · Macomb, US
• Yaping Ge · Shanghai, CN

Key dates

• Filing date: Feb 27, 2017
• Grant date: Aug 18, 2020
• Expiry date: May 4, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68742
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.