Yasuharu Ariga
3Patents
2h-index
6Co-inventors
37Inventor score
Filing activity: Sep 11, 2000 → May 12, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6652356B1 | Wire saw and cutting method | Performing Operations; Transporting | 21 | Expired |
| US7740521B2 | Polishing head, polishing apparatus and polishing method for semiconductor wafer | Performing Operations; Transporting | 5 | Expired |
| US10293460B2 | Method of producing polishing head and polishing apparatus | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.