Wire saw and cutting method
US6652356B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 11, 2000 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Sep 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/045
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is provided a cutting method comprising winding a wire around plural grooved rollers, and pressing the wire against the work with running it, to cut the work, wherein the work is cut with controlling temperature of the work by supplying a cutting fluid containing abrasive grains to the grooved rollers, and supplying a temperature controlling medium to the work and a wire saw. Thereby, influence of the heat generated during cutting process of the work is controlled, and a relative shift of the work and the wire can be suppressed, a level of a warp of a wafer and a local warp can be improved, and flatness in a polishing step can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.