Yasuhiro Ichihara
7Patents
4h-index
19Co-inventors
50Inventor score
Filing activity: Feb 16, 1996 → Aug 31, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5828128A | Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device | Emerging Cross-Sectional Technologies | 84 | Expired |
| US5760469A | Semiconductor device and semiconductor device mounting board | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6749347B1 | Laser diode module and assembling method therefor | Physics | 13 | Expired |
| US7733666B2 | Circuit board storage bag and storage rack | Performing Operations; Transporting | 12 | Active |
| US6498307B2 | Electronic component package, printing circuit board, and method of inspecting the printed circuit board | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7004646B2 | Receptacle type optical transmitter and/or receiver module | Electricity | 2 | Expired |
| US6727718B2 | Electronic component package, printed circuit board, and method of inspecting the printed circuit board | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.