Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device
US5828128A · kind A · utility
84Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1996 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Feb 21, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.