YI-KUN WANG
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Apr 30, 2019 → Apr 30, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11029260B2 | Solder paste printing quality inspection system and method | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.