Solder paste printing quality inspection system and method
US11029260B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Sep 18, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.