Yiping Si
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Jan 9, 2020 → Jan 9, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11088053B2 | Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.