Patent · US Active

Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same

US11088053B2 · kind B2 · utility

0Cited by

0References

10Claims

0Family size

Assignee

GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD. · CN

Inventors

Xilin Rao · Dongguan, CN
Zhengguo Wen · Dongguan, CN
Jianwei Yang · Beijing, CN
Yiwei Huang · Erlangen, DE
Yiping Si · Dongguan, CN
Fangbiao Liu · Dongguan, CN

Key dates

Filing date	Jan 9, 2020
Grant date	Aug 10, 2021
Priority date	—
Expiry date	Jan 9, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention discloses an encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same. The encapsulation structure includes a package, a die pad and a plurality of leads, wherein the die pad and the leads are disposed at a bottom of the package; bottom surfaces of the leads expose in a bottom surface of the package, and the leads extends towards multiple sides of the package until beyond the package; the package includes an integrated circuit provided on the die pad and connected with the leads, and a plastic package for packaging the integrated circuit, the die pad and the leads; a bottom surface of the die pad and the bottom surfaces of the leads are provided on the same horizontal plane; the leads comprise a first lead distant from the die pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.