Yogendra Ranade
4Patents
2h-index
13Co-inventors
34Inventor score
Filing activity: Aug 17, 2001 → May 18, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6759921B1 | Characteristic impedance equalizer and an integrated circuit package employing the same | Electricity | 7 | Expired |
| US7145232B2 | Construction to improve thermal performance and reduce die backside warpage | Electricity | 4 | Expired |
| US7354790B2 | Method and apparatus for avoiding dicing chip-outs in integrated circuit die | Electricity | 1 | Expired |
| US6825066B2 | Stiffener design | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.