Yoshiko KIRA
2Patents
0h-index
9Co-inventors
24Inventor score
Filing activity: Nov 29, 2017 → Sep 16, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12158362B2 | Sensor package and method for attaching sensor package | Physics | 0 | Active |
| US11560499B2 | Adhesive composition, adhesive layer and adhesive sheet | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.