Sensor package and method for attaching sensor package
US12158362B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 16, 2020 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D11/245
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.