Youko Murata
1Patents
1h-index
6Co-inventors
25Inventor score
Filing activity: Apr 5, 2018 → Apr 5, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10242923B2 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.