Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages
US10242923B2 · kind B2 · utility
1Cited by
3References
21Claims
0Family size
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Key dates
| Filing date | Apr 5, 2018 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Apr 5, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/4866
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.