Yousuke Ebihara
2Patents
0h-index
1Co-inventors
18Inventor score
Filing activity: Jan 28, 2016 → Jan 28, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10400086B2 | Thermal expandability adjuster, use as thermal expandability adjuster, thermoset resin composition, insulating material, sealing material and conductive paste each containing thermoset resin composition, cured products, prepreg and member obtained by curing thermoset resin composition of prepreg, method of adjusting thermal expansion rate, and member manufactured using method of adjusting | Electricity | 0 | Active |
| US10364338B2 | Thermal expandability adjuster, use as thermal expandability adjuster, thermoset resin composition, insulating material, sealing material and conductive paste each containing thermoset resin composition, cured products, prepreg and member obtained by curing thermoset resin composition of prepreg, method of adjusting thermal expansion rate, and member manufactured using method of adjusting | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.