Thermal expandability adjuster, use as thermal expandability adjuster, thermoset resin composition, insulating material, sealing material and conductive paste each containing thermoset resin composition, cured products, prepreg and member obtained by curing thermoset resin composition of prepreg, method of adjusting thermal expansion rate, and member manufactured using method of adjusting
US10364338B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2016 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Feb 24, 2036 |
Classification
- Technology area (CPC —)General
Abstract
A thermal expandability adjuster is provided which contains a glycoluril derivative compound represented by formula (1) below. The thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product of a thermoset resin composition used for an insulating resin layer or the like and is effective for suppressing deformation of a circuit substrate due to heating. Compounding the above thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product obtained by curing a thermoset resin composition and it is therefore possible to provide a member that exhibits small deformation due to heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.