Yue Wang
7Patents
3h-index
15Co-inventors
50Inventor score
Filing activity: Dec 27, 2007 → Jul 14, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD890752S1 | Controller | General | 40 | Active |
| US7755897B2 | Memory module assembly with heat dissipation device | Electricity | 29 | Active |
| USD912046S1 | Computing box | General | 13 | Active |
| US11051305B1 | Communication device having concurrent carrier configuration and eSIM profile installation | Electricity | 2 | Active |
| US11632755B2 | Communication device having concurrent carrier configuration and eSIM profile installation | Electricity | 0 | Active |
| US11281510B2 | Intelligent scaling in microservice-based distributed systems | Physics | 0 | Active |
| US12079651B2 | Serverless application function execution | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.