Memory module assembly with heat dissipation device
US7755897B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 27, 2007 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Sep 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.