Yueh-Lung Lin
3Patents
2h-index
11Co-inventors
41Inventor score
Filing activity: Mar 12, 2003 → Mar 17, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7790505B2 | Semiconductor chip package manufacturing method and structure thereof | Electricity | 9 | Active |
| US6768332B2 | Semiconductor wafer and testing method for the same | Physics | 9 | Expired |
| US10147835B2 | Optical device and method of manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.