Yun Li
6Patents
4h-index
6Co-inventors
42Inventor score
Filing activity: Nov 14, 1997 → Aug 30, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6016256A | Multi-chip module having interconnect dies | Electricity | 28 | Expired |
| US6307258A | Open-cavity semiconductor die package | Electricity | 23 | Expired |
| US6421254B2 | Multi-chip module having interconnect dies | Electricity | 10 | Expired |
| US6266246A | Multi-chip module having interconnect dies | Electricity | 6 | Expired |
| US6475832B2 | Open-cavity semiconductor die package | Electricity | 3 | Expired |
| US6709891B2 | Open-cavity semiconductor die package | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.