Multi-chip module having interconnect dies

US6421254B2 · kind B2 · utility

Assignee

• Silicon Bandwidth, Inc., · US

Inventors

• Stanford W. Crane, Jr. · Boca Raton, US
• Lakshminarasimha Krishnapura · Delray Beach, US
• Yun Li · Boca Raton, US
• Moises Behar · Boca Raton, US
• Dan Fuoco · Boca Raton, US
• Bill Ahearn · Boca Raton, US

Key dates

• Filing date: Jul 13, 2001
• Grant date: Jul 16, 2002
• Expiry date: Jul 13, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.