Yunrae Cho
6Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Apr 13, 2020 → Aug 11, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11335668B2 | Semiconductor package and method of fabricating the same | Electricity | 1 | Active |
| US11640951B2 | Integrated circuit device having redistribution pattern | Electricity | 0 | Active |
| US11776894B2 | Semiconductor chip including low-k dielectric layer | Electricity | 0 | Active |
| US12119329B2 | Semiconductor package and method of fabricating the same | Electricity | 0 | Active |
| US12154881B2 | Integrated circuit device having redistribution pattern | Electricity | 0 | Active |
| US11769755B2 | Semiconductor package and method of fabricating the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.