Zaiyi Liao
1Patents
0h-index
2Co-inventors
16Inventor score
Filing activity: Mar 10, 2023 → Mar 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11784425B1 | Chip-to-module cable assembly and PCB circuit | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.