Chip-to-module cable assembly and PCB circuit
US11784425B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2023 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Mar 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This application relates to a chip-to-module cable assembly, includes a first joint, a second joint and a first flexible PCB cable, the flexible PCB cable, including flexible material parts located on upper and lower layers and a connection portion located on a middle layer, wherein the connection portion comprises two rigid material portions respectively located at end portions of the flexible material parts on the upper and lower layers and a hollow portion between the two rigid material portions, the flexible material parts each comprises at least one conducting wire, one end of each of the at least one conducting wire is connected to a first interface terminal of the first joint, and another end of the conducting wire is connected to a second interface terminal of a second joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.