Zhipeng DING
2Patents
0h-index
12Co-inventors
31Inventor score
Filing activity: Jul 9, 2015 → Sep 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11799440B2 | Packaging structure and method of acoustic device | Electricity | 0 | Active |
| US10134607B2 | Method for low temperature bonding of wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.