Zibai Li
3Patents
1h-index
8Co-inventors
30Inventor score
Filing activity: Feb 8, 2021 → Mar 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11609672B1 | Touch control substrate and preparation method thereof, touch control module and display device | Physics | 1 | Active |
| US12112956B2 | Chip interconnection package structure and method | Electricity | 0 | Active |
| US11869872B2 | Chip stack packaging structure and chip stack packaging method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.