Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials

US10000675B2 · kind B2 · utility

Inventors

• John Cleaon Moore · Vail, US
• Jared Pettit · Camarillo, US
• Alman XiMin Law · Camarillo, US

Key dates

• Filing date: Feb 28, 2014
• Grant date: Jun 19, 2018
• Expiry date: Sep 3, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/68381
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Compositions and methods are described for a temporary adhesive with adjustable adhesion force to affix a thin solid material onto a carrier whereby the force of adhesion is defined by choosing and adjusting the polymeric resin components to provide sufficient adhesion to support a manufacturing process, and upon completion, the thin solid material is removed by an external applied force of a given value that overcomes the adhesive force without harm to the thin solid material. The temporary adhesive provides a tunable adhesion force that is lower than the tensile strength of the thin solid material, preferably less than 50%, more preferably less than 25%, and most preferably less than 10% of the tensile strength of the thin solid material. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the thin solid material and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult thin solid materials in the manufacture of semiconductors and flat panel displays.