Jared Pettit
9Patents
1h-index
5Co-inventors
36Inventor score
Filing activity: Feb 28, 2014 → Jan 24, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9455283B2 | Etch chemistries for metallization in electronic devices | Physics | 2 | Active |
| US10923514B2 | Etch chemistries for metallization in electronic devices | Physics | 1 | Active |
| US10186530B2 | Etch chemistries for metallization in electronic devices | Physics | 1 | Active |
| US10290531B2 | Release layer for subsequent manufacture of flexible substrates in microelectronic applications | Electricity | 0 | Active |
| US10696874B2 | Adhesive with tunable porosity and methods to support temporary bonding applications | Electricity | 0 | Active |
| US10000675B2 | Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials | Electricity | 0 | Active |
| US10147630B2 | Sectional porous carrier forming a temporary impervious support | Electricity | 0 | Active |
| US11004718B2 | Sectional porous carrier forming a temporary impervious support | Electricity | 0 | Active |
| US9790407B2 | Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturing | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.