Patent · US Active

Integrated self-coining probe

US10001508B2 · kind B2 · utility

4Cited by

7References

8Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Yang Liu · Shanghai, CN
Steven L. Wright · Whitehall Corners, US

Key dates

Filing date	Jun 17, 2016
Grant date	Jun 19, 2018
Priority date	—
Expiry date	Jun 28, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/71
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe head that contains a coining surface and a plurality of probe tips integrated on a same side of the probe head is provided. The probe head has a first portion and a laterally adjacent second portion, wherein the first portion of the probe head contains the coining surface, and the second portion of the probe head contains the plurality of the probe tips. Each probe tip may, in some embodiments, extend outwards from a probe pedestal that is in contact with the second portion of the probe head. The probe head is traversed across the surface of a semiconductor wafer containing a plurality of solder bump arrays such that the coining surface contacts a specific array of solder bumps prior to contacting of the same specific array of solder bumps with the probe tips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.