Steven L. Wright
69Patents
15h-index
101Co-inventors
87Inventor score
Filing activity: Jun 6, 1983 → Dec 21, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5751421A | Near infrared spectrometer used in combination with a combine for real time grain analysis | Physics | 103 | Expired |
| US5991025A | Near infrared spectrometer used in combination with an agricultural implement for real time grain and forage analysis | Physics | 88 | Expired |
| US6801220B2 | Method and apparatus for adjusting subpixel intensity values based upon luminance characteristics of the subpixels for improved viewing angle characteristics of liquid crystal displays | Physics | 87 | Expired |
| US5019882A | Germanium channel silicon MOSFET | Electricity | 73 | Expired |
| US6363478B1 | Security mechanisms in a web server | Electricity | 60 | Expired |
| US6483583B1 | Near infrared spectrometry for real time analysis of substances | Physics | 59 | Expired |
| US5021365A | Compound semiconductor interface control using cationic ingredient oxide to prevent fermi level pinning | Emerging Cross-Sectional Technologies | 40 | Expired |
| US6690383B1 | Color calibration of displays | Electricity | 37 | Expired |
| US5098859A | Method for forming distributed barrier compound semiconductor contacts | Electricity | 32 | Expired |
| US6697037B1 | TFT LCD active data line repair | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5086321A | Unpinned oxide-compound semiconductor structures and method of forming same | Electricity | 22 | Expired |
| US7474540B1 | Silicon carrier including an integrated heater for die rework and wafer probe | Emerging Cross-Sectional Technologies | 21 | Active |
| US11164817B2 | Multi-chip package structures with discrete redistribution layers | Electricity | 20 | Active |
| US4843450A | Compound semiconductor interface control | Electricity | 15 | Expired |
| US8507847B2 | Microengineered multipole ion guide | Electricity | 15 | Active |
| US8558167B2 | Microengineered multipole rod assembly | Electricity | 14 | Active |
| US11094637B2 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Electricity | 14 | Active |
| US7492821B2 | System and method for selective image capture, transmission and reconstruction | Electricity | 11 | Active |
| US8796616B2 | Miniature mass spectrometer system | Electricity | 11 | Active |
| US9391040B2 | Planarity-tolerant reworkable interconnect with integrated testing | Electricity | 10 | Active |
| US6870643B2 | Method and system for error diffusion with a plurality of error measures | Physics | 9 | Expired |
| US4849802A | Thermally stable low resistance contact | Electricity | 9 | Expired |
| US7435952B2 | Integrated analytical device | Electricity | 8 | Active |
| US5158896A | Method for fabricating group III-V heterostructure devices having self-aligned graded contact diffusion regions | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5162891A | Group III-V heterostructure devices having self-aligned graded contact diffusion regions and method for fabricating same | Emerging Cross-Sectional Technologies | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.