Substrate processing system and substrate processing method
US10002777B2 · kind B2 · utility
5Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2016 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Nov 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.